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Volumn , Issue , 2007, Pages
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The effect of SnxAgCu and SnAgCuX on the mechanical drop performance in lead free CSP package
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Author keywords
[No Author keywords available]
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Indexed keywords
ARSENIC COMPOUNDS;
BRAZING;
CHEMICAL ENGINEERING;
CHLORINE COMPOUNDS;
COMPUTER OPERATING PROCEDURES;
CONSUMER PRODUCTS;
COPPER;
DROPS;
ELECTRIC CURRENTS;
ELECTRONICS INDUSTRY;
ELECTRONICS PACKAGING;
FLUID MECHANICS;
INTERMETALLICS;
METALS;
ORES;
PRODUCT DEVELOPMENT;
RELIABILITY;
RESINS;
SEMICONDUCTING INTERMETALLICS;
SILVER;
SOLDERING;
TECHNOLOGY;
TESTING;
THERMAL AGING;
VEHICLES;
WELDING;
BGA PACKAGES;
COMPONENT MANUFACTURERS;
CONSUMER ELECTRONIC PRODUCTS;
DROP TESTING;
ELECTRONIC PACKAGING;
ELEMENT ADDITION;
END PRODUCTS;
INTERMETALLIC COMPOUNDS;
INTERNATIONAL CONFERENCES;
LEAD-FREE;
LEAD-FREE PRODUCTS;
MICROSTRUCTURE CONTROLLING;
MOISTURE RESISTANCE;
MORPHOLOGY EVOLUTION;
PC BOARDS;
PEAK TEMPERATURES;
REFLOW CONDITIONS;
REFLOW TEMPERATURES;
RESIN MATERIALS;
SINGLE LAYERS;
SN-AG-CU SOLDER;
SOLDER BALLS;
SOLDER JOINTS;
SOLDER PASTES;
TEST VEHICLES;
SOLDERING ALLOYS;
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EID: 50249149435
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ICEPT.2007.4441434 Document Type: Conference Paper |
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Times cited : (1)
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References (11)
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