The performance of compact thermal models for LED package

Thermochimica Acta

Volumn 488, Issue 1-2, 2009, Pages 33-38

  Chen, Huanting ^a   Lu, Yijun ^a   Gao, Yulin ^a   Zhang, Haibing ^a   Chen, Zhong ^a  

^a XIAMEN UNIVERSITY   (China)

Author keywords

Compact thermal model; Finite volume method; Junction temperature; Light emitting diode (LED)

Indexed keywords

BOUNDARY CONDITIONS; FINITE VOLUME METHOD; LIGHT EMISSION; PHYSICAL OPTICS; POWDERS; THERMOGRAPHY (TEMPERATURE MEASUREMENT);

ACCURATE PREDICTIONS; COMPACT THERMAL MODEL; EXPERIMENTAL DATUM; FINITE VOLUME SIMULATIONS; JUNCTION TEMPERATURE; LIGHT EMITTING DIODE (LED); MULTI CHIPS; RESISTANCE MODELS; SINGLE CHIPS; THERMAL COUPLINGS; THERMAL RESISTANCES;

LIGHT EMITTING DIODES;

EID: 62849105581     PISSN: 00406031     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tca.2008.12.019     Document Type: Article

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