Wafer Plane Inspection with soft resist thresholding

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7122, Issue , 2008, Pages

  Hess, Carl ^a   Shi, Rui Fang ^a   Wihl, Mark ^a   Xiong, Yalin ^a   Pang, Song ^a  

^a KLA TENCOR CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALTERNATIVE APPROACHES; BETA TESTING; COMBINATION MODES; DEFECT DETECTIONS; DETECTION ALGORITHMS; HIGH FIDELITIES; HIGH NUMERICAL APERTURES; HIGH SIGNAL-TO-NOISE RATIOS; KLA-TENCOR; LITHOGRAPHIC PROCESS; MASK FEATURES; PRINTING DEFECTS; RESIST MODELS; RETICLE INSPECTIONS; ROBUST SOLUTIONS; TERASCAN; THRESHOLDING;

DEFECTS; MASKS; PRINTING;

INSPECTION;

EID: 62649137532     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.801866     Document Type: Conference Paper

References (9)

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