A novel approach: High resolution inspection with wafer plane defect detection

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7028, Issue , 2008, Pages

  Hess, Carl ^a   Wihl, Mark ^a   Shi, Rui Fang ^a   Xiong, Yalin ^a   Pang, Song ^a  

^a KLA TENCOR CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER NETWORKS; DEFECTS; DETECTORS; DIES; IMAGE ENHANCEMENT; INDUSTRIAL ENGINEERING; INDUSTRY; INSPECTION EQUIPMENT; INTEGER PROGRAMMING; INTELLECTUAL PROPERTY; MASKS; OPTICAL INSTRUMENTS; PHOTOACOUSTIC EFFECT; PHOTORESISTORS; PHOTORESISTS; PRINTING; SCANNING; SODIUM; STANDARDS; SURFACE TREATMENT; TECHNOLOGY;

(+ MOD 2N) OPERATION; (SPM) CLASSES; AERIAL IMAGING; APPLIED (CO); DEFECT DETECTION; DEFECT DETECTORS; DETECTOR TECHNOLOGIES; FUTURE WORK; HARDWARE MODIFICATIONS; HIGH NA; HIGH RESOLUTION INSPECTION; HIGH RESOLUTIONS; HIGH-RESOLUTION (HR) IMAGES; INSPECTION SYSTEMS; MANUFACTURING PROCESSES; MASK DEFECTS; MASK FEATURES; MASK MANUFACTURERS; MASK PATTERNING; MASK TECHNOLOGY; NEXT-GENERATION LITHOGRAPHY (NGL); NODE DEVELOPMENT; NOVE L APPROACH; PHOTO MASKING; PHOTORESIST PLANE; POLARIZATION EFFECTS; PRECISE MODELING; PRINTING DEFECTS; PROPERTY (S); RETICLE DEFECTS; RETICLE INSPECTION;

INSPECTION;

EID: 45549086451     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.793056     Document Type: Conference Paper

References (8)

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