High power multichip modules employing the planar embedding technique and microChannel water heat sinks

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 20, Issue 4, 1997, Pages 432-440

  Hahn, Robert ^a   Kamp, Andreas ^a   Ginolas, Arnim ^a   Schmidt, M ^a   Wolf, Jürgen ^a   Glaw, Veronika ^a   Topper, Michael ^a   Ehrmann, Oswin ^a   Reichl, Herbert ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

Adhesive joining; Embedding technology; High density interconnect; High power module; Micro channel heat sinks; Multichip module; Planarization; Thermal grease; Thermal management

Indexed keywords

ADHESION; HEAT FLUX; HEAT LOSSES; HEAT RESISTANCE; HEAT SINKS; MULTICHIP MODULES; SEMICONDUCTOR DEVICE MANUFACTURE; THERMOSETS;

ADHESIVE JOINING; HIGH DENSITY INTERCONNECTS; MICROCHANNEL WATER HEAT SINKS; PLANAR EMBEDDING TECHNOLOGY; PLANARIZATION;

ELECTRONICS PACKAGING;

EID: 0031360416     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.650932     Document Type: Article

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