Fabrication and electrical characterization of densified carbon nanotube micropillars for IC interconnection

IEEE Transactions on Nanotechnology

Volumn 8, Issue 2, 2009, Pages 196-203

  Liu, Zhengchun ^a   Ci, Lijie ^a,b   Kar, Swastik ^a   Ajayan, Pulickel M ^a,b   Lu, Jian Qiang ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b Rice University   (United States)

Author keywords

Carbon nanotube (CNT); Densification; IC interconnection; Resistance

Indexed keywords

BASIC BUILDING BLOCKS; CONDUCTING PERFORMANCE; CROSS SECTIONS; DENSIFICATION PROCESS; ELECTRICAL CHARACTERIZATIONS; HIGH DENSITIES; IC CHIPS; IC INTERCONNECTION; MICROPILLARS; PARYLENE; RESISTANCE; SITE DENSITIES; THERMAL CONDUCTORS;

CARBON NANOTUBES;

EID: 62449170873     PISSN: 1536125X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TNANO.2008.2011774     Document Type: Article

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