PoP (Package-on-Package) stacking yield loss study

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1403-1408

  Ishibashi, Kazuo ^a  

^a Nokia Japan   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

INTERFACES (MATERIALS); MONTE CARLO METHODS; PRODUCT DESIGN; SOLDERING; SUBSTRATES;

CONVENTIONAL FLUX; REFLOW WARPAGE; SOLDER JOINTS; STACKING YIELD LOSS;

ELECTRONICS PACKAGING;

EID: 35348856825     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373978     Document Type: Conference Paper

References (3)

1. Maeda, Tadashi et al, "New concept paste material for improving PoP SMT yield in mobile products", KGD Packaging and Test Workshop (2006)
2. Dreiza, Moody et al, "High Density PoP (Package-onPackage) and Package Stacking Development", to be presented at ECTC 2007
3. JEITA specification draft (as of Feb. 2007) "Package reflow warpage measurement and warpage tolerance" (in Japanese)