The development of the fan-in Package-on-Package

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 956-963

  Carson, Flynn ^a   Lee, Seong Min ^b   Yoon, In Sang ^b  

^a STATS ChipPAC Ltd   (United States)

^b STATS ChipPAC Korea Ltd   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BOARD-LEVEL RELIABILITY; BUSINESS MODEL; DEVICE INTEGRATION; ELECTRONIC COMPONENTS;

TELECOMMUNICATION EQUIPMENT;

POLLUTION;

EID: 51349102720     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550091     Document Type: Conference Paper

References (9)

1. Carson, Flynn., "POP Developments and Trends," Proc 2006 IMAPs Device Packaging Conf, Scottsdale, AZ, Mar. 2006.
2. th IEEE ECTC, Reno, NV, May 2007, pp 737-742
3. JEDEC, "Fine-pitch, Square Ball Grid Array (FBGA) Package-on-Package (PoP)", JEDEC Publication 95, Design Guide 4.22, Nov 2007 (Issue B).
4. JEDEC, " High Temperature Package Warpage Measurement Methodology", JESD22-B112, May 2005.
5. th IEEE ECTC, Reno, NV, May 2007, pp 1403-1408.
6. JEDEC, "Board Level Drop Test Method of Components for Handheld Electronic Products:, JESD22-B111, July 2003.
7. Carson, Flynn, "Drop Test Performnace of Lead Free PBGA Packages", Proceedings IWLPC, Nov. 2005.
8. Kang, Sung K et al, "Evaluation of Thermal Fatigue Life and Failure Mechanisms of Sn-Ag-Cu Solder Joints with Reduced Ag Contents," Proceedings IEEE Electronic Components and Technology Conference, June 2004.
9. Amagai, Masazumi et al, "High Drop Test Reliability: Lead-free Solders," Proceedings IEEE Electronic Components and Technology Conference, June 2004.