Controlling top package warpage for POP applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 737-742

  Carson, Flynn ^a   Lee, Seong Min ^a   Vijayaragavan, Niranjan ^b  

^a STATS ChipPAC Ltd   (United States)

^b Submicron Development Center   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

LOGIC PROCESSORS; PACKAGE ON PACKAGE (POP); VERTICAL STACKING SOLUTIONS;

MOBILE PHONES; PORTABLE EQUIPMENT; PRINTED CIRCUIT BOARDS; STACKING FAULTS;

ELECTRONICS PACKAGING;

EID: 35348852546     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373879     Document Type: Conference Paper

References (8)

1. Carson, Flynn, "POP Developments and Trends," Proc 2006 IMAPs Device Packaging Conf, Scottsdale, AZ, Mar. 2006
2. JEDEC, "High Temperature Package Warpage Measurement Methodology", JESD22B112, May 2005.
3. Kong, Janet W.Y., et al., "Warpage in Plastic Packages: Effects of Process Conditions, Geometry, and Materials." IEEE Transactions on Electronics Packaging Manufacturing, Vol. 26, No. 3, July 2003, pp. 245-252.
4. th ECTC, 1994, pp. 102-106
5. Yang, W-L., Yin, D.M.S, "The Effects of Epoxy Molding Compound Composition on the Warpage and Popcorn Resistance of PBGA," ECTC, 1998, pp. 721-726
6. Kousaka, T., Suzuki, N., and Yasuda, M., "Influence of Material Combination on Warpage and Reflow Crack Resistance of PBGA," IEEE CPMT Electronics Packaging Technology Conf, 1998, pp. 296-301
7. Wang, Y., Hassell, P., "Measurement of Thermally Induced Warpage of BGA Packages/Substrates Using Phase-Stepping Shadow Moire," IEEE CPMT Electronic Packaging Technology Conf., 1997, pp 283-289
8. Dreiza, M., Smith, L., Dunn, G., Vijayaragavan, N., Werner, J., "Package on Package Stacking and Board Level Reliability, Results of a Joint Industry Study," IMAPS Device Packaging Conf, Scottsdale, AZ, Mar. 2006