Package on package warpage - Impact on surface mount yields and board level reliability

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 389-396

  Vijayaragavan, Niranjan ^a   Carson, Flynn ^b   Mistry, Addi ^c  

^a Submicron Development Center   (United States)

^b STATS ChipPAC Ltd   (United States)

^c FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

WARPAGE;

COMPUTER NETWORKS; CONTRACTORS; CONTRACTS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONIC EQUIPMENT TESTING; MOUNTINGS; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; RELIABILITY; SURFACE MOUNT TECHNOLOGY; TELECOMMUNICATION EQUIPMENT;

POLLUTION;

EID: 51349161848     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550001     Document Type: Conference Paper

References (10)

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2. th IEEE ECTC, Reno, NV, May 2007, pp 737-742
3. JEDEC, " High Temperature Package Warpage Measurement Methodology", JESD22B112, May 2005.
4. Kong, Janet W.Y., et al., "Warpage in Plastic Packages: Effects of Process Conditions, Geometry, and Materials." IEEE Transactions on Electronics Packaging Manufacturing, Vol. 26, No. 3, July 2003, pp. 245-252.
5. th ECTC, 1994, pp. 102-106
6. Yang, W-L., Yin, D.M.S, "The Effects of Epoxy Molding Compound Composition on the Warpage and Popcorn Resistance of PBGA," Proc of the ECTC, 1998, pp. 721-726
7. Kousaka, T., Suzuki, N., and Yasuda, M., "Influence of Material Combination on Warpage and Reflow Crack Resistance of PBGA," IEEE CPMT Electronics Packaging Technology Conf., 1998, pp. 296-301
8. Wang, Y., Hassell, P., "Measurement of Thermally Induced Warpage of BGA Packages/Substrates Using Phase-Stepping Shadow Moire," IEEE CPMT Electronic Packaging Technology Conf., 1997, pp 283-289
9. Dreiza, M., Smith, L., Dunn, G., Vijayaragavan, N., Werner, J., "Package on Package Stacking and Board Level Reliability, Results of a Joint Industry Study," IMAPS Device Packaging Conf., Scottsdale, AZ, Mar. 2006
10. JEDEC, "Board Level Drop Test Method of Components for Handheld Electronic Products", JESD22-B111, July 2003.