Nanocutting process of CdZnTe single crystals

Materials and Manufacturing Processes

Volumn 24, Issue 4, 2009, Pages 504-508

  Guo, Dongming ^a   Zhang, Zhenyu ^a,b,c   Kang, Renke ^a   Gao, Hang ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

^b YANSHAN UNIVERSITY   (China)

^c HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

AFM; Al2O3 powder; Berkovich indenter; CdZnTe; Chemical mechanical polishing; Cutting speed; In situ scanning; Lapping; Nanocutting; Nanoindenter; Nanosphere; Polishing slurry; SiO2; Soft brittle materials; TEM

Indexed keywords

ATOMIC FORCE MICROSCOPY; BRITTLENESS; CADMIUM ALLOYS; CADMIUM COMPOUNDS; CHEMICAL MECHANICAL POLISHING; LAPPING; NANOINDENTATION; NANOSPHERES; POLISHING; POWDERS; SCANNING; SILICON OXIDES; SINGLE CRYSTALS; SURFACE ROUGHNESS; SURFACES; TELLURIUM COMPOUNDS;

AFM; AL2O3 POWDER; BERKOVICH INDENTER; CDZNTE; CUTTING SPEED; IN-SITU SCANNING; NANOCUTTING; NANOINDENTER; POLISHING SLURRY; SIO2; SOFT BRITTLE MATERIALS; TEM;

CHEMICAL POLISHING;

EID: 61449189850     PISSN: 10426914     EISSN: 15322475     Source Type: Journal    
DOI: 10.1080/10426910802714605     Document Type: Article

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