Avoiding Tin Whisker reliability problems

Circuits Assembly

Volumn 15, Issue 8, 2004, Pages 26-31

  Galyon, G T ^a   Gedney, Ron ^b  

^a IBM   (United States)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

MOLDED PLASTIC HOUSING; QUAD FLAT PACK (QFP); TIN-LEAD (SN-PB) COATINGS; WHISKER DENSITY;

CERAMIC CAPACITORS; COPPER ALLOYS; DATA ACQUISITION; HAZARDOUS MATERIALS; INTEGRATED CIRCUITS; PERSONAL DIGITAL ASSISTANTS; PRINTED CIRCUIT BOARDS; RISK ASSESSMENT; SURFACE MOUNT TECHNOLOGY;

CRYSTAL WHISKERS;

EID: 5444244980     PISSN: 10540407     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (5)

1. K.G. Compton, A. Mendizza and S.M. Arnold, "Filamentary Growths on Metal Surfaces-Whiskers," Corrosion, 7: pp. 327-334, 1951.
2. J.R. Downs, "The Phenomenon of Zinc Whisker Growth and the Rotary Switch (or How the Switch Industry Captured the Abominable Snow-man," Metal Finishin, pp. 23-25, August 1994.
3. nd Capacitor and Resistor Technology Symposium (CARTS), pp. 67-80, March 2002.
4. J.C. Bing-Lee, Y.L. Yao, F. Y. Chiang, P.J. Zheng, C.C. Liao and Y.S. Chou, "Characterization Study of Lead-Free Sn-Cu Plated Packages," Proc. Of the 2002 Electronic Components and Technology Conference (IEEE ECTC), pp. 1238-1245, 2002.
5. Private communication, J. Smetana, Alcatel Corporation, 2003.