Thermal and mechanical analysis of high power leds with ceramic packages

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 5, Issue , 2007, Pages 251-255

  Hu, Jianzheng ^a   Yang, Lianqiao ^a   Shin, Moo Whan ^a  

^a Myong Ji University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

LIGHT EMITTING DIODES; MOLDS; THERMAL EXPANSION;

COEFFICIENTS OF THERMAL EXPANSIONS; HIGH POWER LIGHT EMITTING DIODES; MECHANICAL CHARACTERISTICS; THERMAL AND MECHANICAL ANALYSIS; THERMAL PERFORMANCE; THERMO-MECHANICAL STRESS; THERMOMECHANICAL SIMULATION; TRANSIENT THERMAL MEASUREMENT;

CERAMIC MATERIALS;

EID: 60449091636     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE200741759     Document Type: Conference Paper

References (8)

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