Thermal modeling and performance of LED packaging for illuminating device

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6337, Issue , 2006, Pages

  Hwu, Farn Shiun ^a,b   Sheu, Gwo Jiun ^a   Chen, Jyh Chen ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

^b NANYA INSTITUTE OF TECHNOLOGY   (Taiwan)

Author keywords

Dielectric layer; LED; Packaging; Thermal management

Indexed keywords

DIELECTRIC DEVICES; ELECTRONICS PACKAGING; HEAT CONVECTION; HEAT LOSSES; HEAT RESISTANCE;

CONVECTIVE EFFECT; DIELECTRIC LAYERS; HEAT DISSIPATING PACKAGE; THERMAL MANAGEMENT;

LIGHT EMITTING DIODES;

EID: 33751104253     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.678949     Document Type: Conference Paper

References (11)

1. I. Niki, Y. Namkawa, D. Morita, S. Sonobe, T. Mitani, H. Tamaki, Y. Murazaki, M. Yamada, and T. Mukai, "White LEDs for Solid State Lighting," Proc. SPIE Vol. 5187, Third International Conference on Solid State Lighting, 2004.
2. M. Arik, J. Petroski, and S. Weaver, "Thermal Challenges in the Future Generation Solid State Lighting Applications: Light Emitting Diodes," ASME/IEEEINTERPACK 2001 Conference, Kauai, Hawaii, 2001.
3. G. J. Sheu, F. S. Hwu, S. H. Tu, W. T. Chen, J. Y. Chang, and J. C. Chen, "The Heat Dissipation Performance of LED Applied a MHP," Proc. SPIE Vol. 5941, Fifth International Conference on Solid State Lighting, 2005.
4. F. Wall, P. S. Martin, and G. Harbers, "High Power LED Package Requirements," Proc. SPIE Vol. 5187, Third International Conference on Solid State Lighting, 2004.
5. Y. C. Lee, J. C. Chen, F. S. Hwu, G. J. Sheu, W. D. Chen, and J. Y. Chang, "Passive heat dissipation devices for high power LEDs," Proc. of the Eighth Chinese Optoelectronics Symposium, 2006.
6. M. Arik, C. Becker, S. Weaver, and J. Petroski, "Thermal Management of LEDs: Package to System," Proc. SPIE Vol. 5187, Third International Conference on Solid State Lighting, 2004.
7. M. Shatalov, A. Chitnis, P. Yadav, M. F. Hasan, J. Khan, V. Adivarahan, H. P. Maruska, W. H. Sun, and M. Asif Khan, "Thermal Analysis of Flip-Chip Packaged 280 nm Nitride-Based Deep Ultraviolet Light-Emitting Diodes," Applied Physics Letters 86, 201109, 2005.
8. M. Arik, and S. Weaver, "Chip Scale Thermal Management of High Brightness LED Packages," Proc. SPIE Vol. 5530, Fourth International Conference on Solid State Lighting, 2004.
9. G. J. Sheu, F. S. Hwu, C. H. Cheng, and J. C. Chen, "A Thermal Model and Performance Evaluation of Light Emitting Diode Packaging for Illumination Devices," IEEE Transactions on Advanced Packaging, 2006. (Under review)
10. G. J. Sheu, F. S. Hwu, and J. C. Chen, "The influences on system thermal resistance of LED packaging with substrate conditions and surrounding factors," Journal of Applied Physics, 2006. (Submitting)
11. M. Arik, J. Garg, and A. Bar-Cohen. "Thermal Modeling and Performance of High Heat Flux SOP Packages," IEEE Transactions on Advanced Packaging, Vol. 27, 2004.