High efficiency silicon-based high power LED package integrated with micro- thermoelectric device

Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT

Volumn , Issue , 2007, Pages 29-33

  Chun, Kai Liu ^a   Dai, Ming Ji ^a   Yu, Chih Kuang ^a   Kuo, Sheng Liang ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; COOLING SYSTEMS; DC GENERATORS; MICROSYSTEMS; NONMETALS; OPTICAL DESIGN; PHYSICAL OPTICS; SEMICONDUCTING SILICON COMPOUNDS; SILICON; TECHNOLOGY; THERMOELECTRIC EQUIPMENT; THERMOELECTRICITY;

CONVERSION METHODS; FLIP-CHIP ASSEMBLIES; HIGH POWERS; HIGH-EFFICIENCY; HIGH-POWER LED; INFRA-RED CAMERAS; INPUT POWERS; INTEGRATING SPHERES; JUNCTION TEMPERATURES; LIGHT EFFICIENCY; LIGHT-EMITTING DIODE; MEMS FABRICATION; SILICON-BASED; THERMAL MANAGEMENT; THERMAL RESISTANCE;

LIGHT EMITTING DIODES;

EID: 48649094169     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IMPACT.2007.4433562     Document Type: Conference Paper

References (7)

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