The role of plasticity in bimaterial fracture with ductile interlayers

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 31, Issue 13, 2000, Pages 863-872

  Tymiak, N I ^a   Volinsky, A A ^a   Kriese, M D ^b   Downs, S A ^c   Gerberich, W W ^a  

^a UNIVERSITY OF MINNESOTA   (United States)

^b Osmic Inc   (United States)

^c Bruker Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPROPRIATE MODELS; AXISYMMETRIC; BI-LAYER; BI-MATERIAL FRACTURE; CONSTITUTIVE PROPERTIES; CRACK TIP PLASTICITY; CU FILMS; CU INTERLAYERS; DOMINANT MECHANISM; ELASTIC-PLASTIC; EXPERIMENTAL VALUES; FAR FIELD; FIRST-ORDER; FLOW STRESS; INDENTATION TEST; INTERFACIAL CRACKS; INTERFACIAL FRACTURE ENERGY; INTERFACIAL TOUGHNESS; LARGE STRAINS; MODE MIXITY; OXIDIZED SILICON; PLASTIC DISSIPATION; PLASTIC ENERGY DISSIPATION; PLASTIC STRAIN ENERGY DENSITY; SMALL STRAINS; THEORETICAL PREDICTION;

COPPER; CRACK PROPAGATION; CRACK TIPS; DENSITY MEASUREMENT (SPECIFIC GRAVITY); DUCTILE FRACTURE; ELECTRON ENERGY LOSS SPECTROSCOPY; ENERGY DISSIPATION; ENERGY DISSIPATORS; PLASTICITY; PLASTICS; SILICON OXIDES; STRAIN ENERGY; TUNGSTEN; YIELD STRESS;

STRAIN RATE;

EID: 0000261721     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-000-1006-1     Document Type: Article

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