Mold deformation in soft UV-nanoimprint lithography

Science in China, Series E: Technological Sciences

Volumn 52, Issue 2, 2009, Pages 294-302

  Lan, Hongbo ^a,b   Ding, Yucheng ^a   Liu, Hongzhong ^a   Que, Yerong ^a   Tao, Weiwei ^a   Li, Hansong ^a   Lu, Bingheng ^a  

^a XI'AN JIAOTONG UNIVERSITY   (China)

^b SHANDONG UNIVERSITY   (China)

Author keywords

Deformation; Finite element model; Numerical simulation; Soft mold; UV nanoimprint lithography (UV NIL)

Indexed keywords

COMPUTER SIMULATION; DEFORMATION; ELECTRIC NETWORK ANALYSIS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MOLDS;

AFFECTED FACTORS; EXPERIMENTAL STUDIES; FINITE ELEMENT MODEL; FINITE ELEMENTS; HIGH THROUGHPUTS; IMPRINTING PROCESS; LOW COSTS; MOLD DEFORMATIONS; MOLD DESIGNS; NUMERICAL SIMULATION; SIMPLIFIED MODELS; SOFT MOLD; SUB-MICRON SCALE; UV-NANOIMPRINT LITHOGRAPHY (UV-NIL);

NANOIMPRINT LITHOGRAPHY;

EID: 59849089611     PISSN: 10069321     EISSN: 1862281X     Source Type: Journal    
DOI: 10.1007/s11431-008-0199-1     Document Type: Article

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