Liquid cooling in the mini-rectangular fin heat sink with and without thermoelectric for CPU

International Communications in Heat and Mass Transfer

Volumn 36, Issue 2, 2009, Pages 166-171

  Naphon, Paisarn ^a   Wiriyasart, Songkran ^a  

^a THAMMASAT UNIVERSITY   (Thailand)

Author keywords

Heat sink; Liquid cooling; Thermoelectric

Indexed keywords

ALUMINA; COOLANTS; COOLING; COPPER; FINS (HEAT EXCHANGE); LIQUIDS;

CHANNEL WIDTHS; COOLANT FLOW RATES; COOLING TECHNIQUES; DE-IONIZED WATERS; ENERGY CONSUMPTION; FIN HEAT SINKS; HEAT SINK; HEAT TRANSFER PERFORMANCE; LIQUID COOLING; THERMOELECTRIC;

HEAT SINKS;

EID: 59649125264     PISSN: 07351933     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.icheatmasstransfer.2008.10.002     Document Type: Article

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