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Volumn 24, Issue 2-3, 2004, Pages 323-337

An analytical solution of thermal resistance of cubic heat spreaders for electronic cooling

Author keywords

Electronic cooling; Fourier series; Spreading thermal resistance; Three dimensional

Indexed keywords

COOLING; HEAT FLUX; HEAT TRANSFER; HEATING;

EID: 0242489300     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2003.07.001     Document Type: Article
Times cited : (53)

References (10)
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  • 6
    • 0000296338 scopus 로고
    • Spreading resistance in cylindrical semiconductor devices
    • Kennedy D.P. Spreading resistance in cylindrical semiconductor devices. Journal of Applied Physics. 31:1960;1490-1497.
    • (1960) Journal of Applied Physics , vol.31 , pp. 1490-1497
    • Kennedy, D.P.1
  • 7
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    • Closed-form equation for thermal constriction/spreading resistances with variable resistance boundary condition
    • Atlanta, Georgia
    • S. Song, S. Lee, V. Au, Closed-form equation for thermal constriction/spreading resistances with variable resistance boundary condition, in: Proceedings of the 1994 International Electronics Packaging Conference, Atlanta, Georgia, 1994, pp. 111-121.
    • (1994) Proceedings of the 1994 International Electronics Packaging Conference , pp. 111-121
    • Song, S.1    Lee, S.2    Au, V.3
  • 8
    • 0000551402 scopus 로고
    • Constriction/spreading resistance model for electronics packaging
    • Maui, Hawaii
    • S. Lee, S. Song, V. Au, K.P. Moran, Constriction/spreading resistance model for electronics packaging, in: ASME/JSME Thermal Engineering Conference, vol. 4, Maui, Hawaii, 1995, pp. 199-206.
    • (1995) ASME/JSME Thermal Engineering Conference , vol.4 , pp. 199-206
    • Lee, S.1    Song, S.2    Au, V.3    Moran, K.P.4
  • 9
    • 0029674360 scopus 로고    scopus 로고
    • The pressure and velocity fields in the wick structure of a localized heated flat plate heat pipe
    • Huang X.Y., Liu C.Y. The pressure and velocity fields in the wick structure of a localized heated flat plate heat pipe. International Journal of Heat and Mass Transfer. 39(6):1996;1325-1330.
    • (1996) International Journal of Heat and Mass Transfer , vol.39 , Issue.6 , pp. 1325-1330
    • Huang, X.Y.1    Liu, C.Y.2
  • 10
    • 0031122129 scopus 로고    scopus 로고
    • Liquid flow in the anisotropic wick structure of a flat plate heat pipe under block-heating condition
    • Qin W., Liu C.Y. Liquid flow in the anisotropic wick structure of a flat plate heat pipe under block-heating condition. Applied Thermal Engineering. 17(4):1997;339-349.
    • (1997) Applied Thermal Engineering , vol.17 , Issue.4 , pp. 339-349
    • Qin, W.1    Liu, C.Y.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.