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Volumn 48, Issue 1, 2009, Pages

Mechanical properties and chemical reactions at the directly bonded Si-Si interface

(8) Toyoda, Eiji a,b Sakai, Akira c Isogai, Hiromichi a Senda, Takeshi a Izunome, Koji a Nakatsuka, Osamu b Ogawa, Masaki b Zaima, Shigeaki b

a Nissei Bldg (Japan)

b NAGOYA UNIVERSITY (Japan)

c OSAKA UNIVERSITY (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL PROPERTIES; CHEMICAL REACTIONS; GRAFTING (CHEMICAL); HYDROGEN; HYDROPHILICITY; HYDROPHOBICITY; MECHANICAL PROPERTIES; OXYGEN; SEMICONDUCTING SILICON COMPOUNDS; SILICON; SILICON WAFERS; SYNTHESIS (CHEMICAL);

ANNEALING TEMPERATURES; BONDED INTERFACES; BONDED WAFERS; BONDING ENERGIES; BONDING INTERFACES; BONDING MECHANISMS; CHEMICAL PRODUCTS; HYDROPHILIC AND HYDROPHOBIC; OXYGEN ATOMS; SI(1 0 0 );

WAFER BONDING;

EID: 59649114038 PISSN: 00214922 EISSN: 13474065 Source Type: Journal
DOI: 10.1143/JJAP.48.011202 Document Type: Article

Times cited : (20)

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