-
1
-
-
0032254845
-
Integration technology of polymetal (W/WSiN/Poly-Si) dual gate CMOS for 1 Gbit DRAMs and beyond
-
Y. Hiura, A. Azuma, K. Nakagima, Y. Akasaka, K. Miyano, H. Nitta, A. Honjo, K. Tsuchida, Y. Toyoshima, K. Suguro, and Y. Kohyama, "Integration technology of polymetal (W/WSiN/Poly-Si) dual gate CMOS for 1 Gbit DRAMs and beyond," in IEDM Tech. Dig., 1998, pp. 389-392.
-
(1998)
IEDM Tech. Dig
, pp. 389-392
-
-
Hiura, Y.1
Azuma, A.2
Nakagima, K.3
Akasaka, Y.4
Miyano, K.5
Nitta, H.6
Honjo, A.7
Tsuchida, K.8
Toyoshima, Y.9
Suguro, K.10
Kohyama, Y.11
-
2
-
-
0036052954
-
2 stack DRAM cell for multi-gigabit DRAM
-
2 stack DRAM cell for multi-gigabit DRAM," in VLSI Symp. Tech. Dig., 2002, pp. 56-57.
-
(2002)
VLSI Symp. Tech. Dig
, pp. 56-57
-
-
Noh, H.1
Jeong, S.2
Lee, S.3
Kim, Y.4
Cho, W.5
Huh, M.6
Jeong, G.7
Suh, J.8
Kweon, H.9
Roh, J.10
Shin, K.11
Lee, S.12
-
3
-
-
0021483359
-
A new tungsten gate process for VLSI applications
-
Sep
-
S. Iwata, N. Yamamoto, N. Kobayashi, T. Terada, and T. Mizutani, "A new tungsten gate process for VLSI applications," IEEE Trans. Electron Devices, vol. ED-31, no. 9, pp. 1174-1179, Sep. 1984.
-
(1984)
IEEE Trans. Electron Devices
, vol.ED-31
, Issue.9
, pp. 1174-1179
-
-
Iwata, S.1
Yamamoto, N.2
Kobayashi, N.3
Terada, T.4
Mizutani, T.5
-
5
-
-
84949624565
-
Impact of LDD spacer reduction on MOSFET performance for sub-μm gate/space pitches
-
C. Mazure, C. Gunderson, and B. Roman, "Impact of LDD spacer reduction on MOSFET performance for sub-μm gate/space pitches," in IEDM Tech. Dig., 1992, pp. 893-896.
-
(1992)
IEDM Tech. Dig
, pp. 893-896
-
-
Mazure, C.1
Gunderson, C.2
Roman, B.3
-
6
-
-
3042518745
-
Impact of gate sidewall spacer structures on DRAM cell transistors under Fowler-Nordheim and gate-induced drain leakage stress conditions
-
K.-Y. Lim, S.-A. Jang, Y. S. Kim, H.-J. Cho, J.-G. Oh, S.-O. Chung, S.-J. Lee, W.-K. Sun, J.-B. Suh, H.-S. Yang, and H.-C. Sohn, "Impact of gate sidewall spacer structures on DRAM cell transistors under Fowler-Nordheim and gate-induced drain leakage stress conditions," in Proc. Int. Reliab. Phys. Symp., 2004, pp. 485-488.
-
(2004)
Proc. Int. Reliab. Phys. Symp
, pp. 485-488
-
-
Lim, K.-Y.1
Jang, S.-A.2
Kim, Y.S.3
Cho, H.-J.4
Oh, J.-G.5
Chung, S.-O.6
Lee, S.-J.7
Sun, W.-K.8
Suh, J.-B.9
Yang, H.-S.10
Sohn, H.-C.11
-
7
-
-
0035716241
-
-
D.-C. Kim, S.-K. Park, H.-S. Hong, I.-G. Kim, Y.-T. Kim, Y.-B. Kim, H.-S. Kim, H.-S. Park, M.-H. Nam, M.-S. Suh, K.-B. Nam, J.-S. Lee, N.-S. Kim, T.-K. Lee, J.-Y. Kim, S.-H. Lee, B.-C. Lee, H.-Y. Kwon, J.-H. Choi, J.-C. Om, B.-R. Wi, S.-J. Hong, H.-R. Kim, and C.-S. Oh, Impact of rapid thermal annealing on data retention time for 256 Mb and 1 Gb DRAM technology, in IEDM Tech. Dig., 2001, pp. 18.3.1-18.3.4.
-
D.-C. Kim, S.-K. Park, H.-S. Hong, I.-G. Kim, Y.-T. Kim, Y.-B. Kim, H.-S. Kim, H.-S. Park, M.-H. Nam, M.-S. Suh, K.-B. Nam, J.-S. Lee, N.-S. Kim, T.-K. Lee, J.-Y. Kim, S.-H. Lee, B.-C. Lee, H.-Y. Kwon, J.-H. Choi, J.-C. Om, B.-R. Wi, S.-J. Hong, H.-R. Kim, and C.-S. Oh, "Impact of rapid thermal annealing on data retention time for 256 Mb and 1 Gb DRAM technology," in IEDM Tech. Dig., 2001, pp. 18.3.1-18.3.4.
-
-
-
-
9
-
-
0036927326
-
2 process promising for sub-90 nm memory and logic devices
-
2 process promising for sub-90 nm memory and logic devices," in IEDM Tech. Dig., 2002, pp. 229-232.
-
(2002)
IEDM Tech. Dig
, pp. 229-232
-
-
Park, J.-E.1
Ku, J.-H.2
Lee, J.-W.3
Yang, J.-H.4
Chu, K.-S.5
Lee, S.-H.6
Park, M.-H.7
Lee, N.-I.8
Kang, H.-K.9
Suh, K.-P.10
Cho, B.-H.11
Kim, B.-C.12
Shin, C.-H.13
-
10
-
-
0026151653
-
A mechanism of the sidewall process induced junction leakage current of LDD structure
-
May
-
S. Onishi, A. Ayukawa, K. Tanaka, and K. Sakiyama, "A mechanism of the sidewall process induced junction leakage current of LDD structure," J. Electrochem. Soc., vol. 138, no. 5, pp. 1439-1443, May 1991.
-
(1991)
J. Electrochem. Soc
, vol.138
, Issue.5
, pp. 1439-1443
-
-
Onishi, S.1
Ayukawa, A.2
Tanaka, K.3
Sakiyama, K.4
-
11
-
-
0030241405
-
Mechanical stress analysis of an LDD MOSFET structure
-
Sep
-
P. Ferreira, V. Senez, and B. Baccus, "Mechanical stress analysis of an LDD MOSFET structure," IEEE Trans. Electron Devices, vol. 43, no. 9, pp. 1525-1532, Sep. 1996.
-
(1996)
IEEE Trans. Electron Devices
, vol.43
, Issue.9
, pp. 1525-1532
-
-
Ferreira, P.1
Senez, V.2
Baccus, B.3
-
12
-
-
0034454826
-
Impact of gate-induced drain leakage current on the tail distribution of DRAM data retention time
-
K. Saino, S. Horiba, S. Uchiyama, Y. Takaishi, M. Takenaka, T. Uchida, Y. Takada, K. Koyama, H. Miyake, and C. Hu, "Impact of gate-induced drain leakage current on the tail distribution of DRAM data retention time," in IEDM Tech. Dig., 2000, pp. 837-840.
-
(2000)
IEDM Tech. Dig
, pp. 837-840
-
-
Saino, K.1
Horiba, S.2
Uchiyama, S.3
Takaishi, Y.4
Takenaka, M.5
Uchida, T.6
Takada, Y.7
Koyama, K.8
Miyake, H.9
Hu, C.10
-
13
-
-
0001765329
-
Surface dopant concentration monitoring using noncontact surface charge profiling
-
Feb
-
P. Roman, J. Staffa, S. Fakhouri, J. Ruzyllo, K. Torek, and E. Kamieniecki, "Surface dopant concentration monitoring using noncontact surface charge profiling," J. Appl. Phys., vol. 83, no. 4, pp. 2297-2300, Feb. 1998.
-
(1998)
J. Appl. Phys
, vol.83
, Issue.4
, pp. 2297-2300
-
-
Roman, P.1
Staffa, J.2
Fakhouri, S.3
Ruzyllo, J.4
Torek, K.5
Kamieniecki, E.6
-
14
-
-
0036833261
-
Hydrogen-induced boron passivation in Cz Si
-
Nov
-
A. Castaldini, D. Cavalcoli, A. Cavallini, and E. Susi, "Hydrogen-induced boron passivation in Cz Si," Appl. Phys., A Mater. Sci. Process., vol. 75, no. 5, pp. 601-605, Nov. 2002.
-
(2002)
Appl. Phys., A Mater. Sci. Process
, vol.75
, Issue.5
, pp. 601-605
-
-
Castaldini, A.1
Cavalcoli, D.2
Cavallini, A.3
Susi, E.4
-
15
-
-
59649119871
-
-
T. Sanuki, A. Oishi, Y. Morimasa, S. Aota, T. Kinoshita, R. Hasumi, Y. Takegawa, K. Isobe, H. Yoshimura, M. Iwai, K. Sunouchi, and T. Noguchi, Scalability of strained silicon CMOSFET and high drive current enhancement in the 40 nm gate length technology, in IEDM Tech. Dig. 2003, pp. 3.5.1-3.5.4.
-
T. Sanuki, A. Oishi, Y. Morimasa, S. Aota, T. Kinoshita, R. Hasumi, Y. Takegawa, K. Isobe, H. Yoshimura, M. Iwai, K. Sunouchi, and T. Noguchi, "Scalability of strained silicon CMOSFET and high drive current enhancement in the 40 nm gate length technology," in IEDM Tech. Dig. 2003, pp. 3.5.1-3.5.4.
-
-
-
-
16
-
-
59649085686
-
-
V. Chan, R. Rengarajan, N. Rovedo, J. Wei, T. Hook, P. Nguyen, J. Chen, E. Nowak, X.-D. Chen, D. Lea, A. Chakravarti, V. Ku, S. Yang, A. Steegen, C. Baiocco, P. Shafer, H. Ng, S.-F. Huang, and C. Wann, High speed 45 nm gate length CMOSFETs integrated into a 90 nm bulk technology incorporating strain engineering, in IEDM Tech. Dig., 2003, pp. 3.8.1-3.8.4.
-
V. Chan, R. Rengarajan, N. Rovedo, J. Wei, T. Hook, P. Nguyen, J. Chen, E. Nowak, X.-D. Chen, D. Lea, A. Chakravarti, V. Ku, S. Yang, A. Steegen, C. Baiocco, P. Shafer, H. Ng, S.-F. Huang, and C. Wann, "High speed 45 nm gate length CMOSFETs integrated into a 90 nm bulk technology incorporating strain engineering," in IEDM Tech. Dig., 2003, pp. 3.8.1-3.8.4.
-
-
-
-
17
-
-
0034452586
-
Mechanical stress effect of etch-stop nitride and its impact on deep submicron transistor design
-
S. Ito, H. Namba, K. Yamaguchi, T. Hirata, K. Ando, S. Koyama et al. "Mechanical stress effect of etch-stop nitride and its impact on deep submicron transistor design," in IEDM Tech. Dig., 2000, pp. 247-250.
-
(2000)
IEDM Tech. Dig
, pp. 247-250
-
-
Ito, S.1
Namba, H.2
Yamaguchi, K.3
Hirata, T.4
Ando, K.5
Koyama, S.6
-
18
-
-
0038009060
-
Relationship between residual stress and structural properties of AlN films deposited by r.f. reactive sputtering
-
Jul
-
S. H. Lee, K. H. Yoon, D. S. Cheong, and J. L. Lee, "Relationship between residual stress and structural properties of AlN films deposited by r.f. reactive sputtering," Thin Solid Films, vol. 435, no. 1/2, pp. 193-198, Jul. 2003.
-
(2003)
Thin Solid Films
, vol.435
, Issue.1-2
, pp. 193-198
-
-
Lee, S.H.1
Yoon, K.H.2
Cheong, D.S.3
Lee, J.L.4
|