Whisker test methods of JEITA whisker growth mechanism for test methods

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 28, Issue 1, 2005, Pages 10-16

  Sakamoto, Ichizo ^a  

^a Japan Electronics and Information Technology Industries Association   (Japan)

Author keywords

Leadframe package; Pb free plating finish; Tin whiskers; Whisker growth

Indexed keywords

COPPER; CRYSTAL GROWTH; CRYSTAL WHISKERS; DIFFUSION; LEAD PLATING; SCANNING ELECTRON MICROSCOPY; THERMAL CYCLING; TIN;

LEADFRAME PACKAGE; PB-FREE PLATING FINISH; TIN WHISKERS; WHISKER GROWTH;

ELECTRONICS INDUSTRY;

EID: 20344381310     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2005.847436     Document Type: Article

References (13)

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