Design and fabrication of a new MEMS capacitive microphone using a perforated aluminum diaphragm

Sensors and Actuators, A: Physical

Volumn 149, Issue 1, 2009, Pages 29-37

  Ganji, Bahram Azizollah ^a   Majlis, Burhanuddin Yeop ^b  

^a BABOL NOSHIRVANI UNIVERSITY OF TECHNOLOGY   (Iran)

^b INSTITUTE OF MICROENGINEERING AND NANOELECTRONICS IMEN   (Malaysia)

Author keywords

Al perforated diaphragm; MEMS microphone; Silicon backplate; SOG sacrificial layer

Indexed keywords

ALUMINA; ALUMINUM; DIAPHRAGMS; FABRICATION; GALLIUM ALLOYS; LIGHT METALS; MEMS; MICROELECTROMECHANICAL DEVICES; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; SPIN GLASS;

ACOUSTICAL DAMPING; AIR GAPS; AL PERFORATED DIAPHRAGM; CHIP SIZES; FABRICATION COSTS; FABRICATION PROCESSES; INITIAL STRESSES; ISOLATING LAYERS; KOH ETCHINGS; MEMS MICROPHONE; MONOCRYSTALLINE SILICON WAFERS; NUMBER OF LAYERS; PERFORATED ALUMINUMS; SOG SACRIFICIAL LAYER; SPIN-ON; ZERO BIASES;

MICROPHONES;

EID: 58149178476     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2008.09.017     Document Type: Article

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