New methods for measuring mechanical properties of thin films in micromachining: Beam pull-in voltage (VPI) method and long beam deflection (LBD) method

"Sensors and Actuators, A: Physical"

Volumn 48, Issue 2, 1995, Pages 137-143

  Zou, Quanbo ^a   Li, Zhijian ^a   Liu, Litian ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

Micromachining; Stress measurement methods; Thin films

Indexed keywords

COMPRESSION TESTING; DEFLECTION (STRUCTURES); ELASTIC MODULI; ELECTRODES; MECHANICAL PROPERTIES; MECHANICAL VARIABLES MEASUREMENT; MICROMACHINING; STRESS ANALYSIS; STRUCTURE (COMPOSITION); TENSILE TESTING;

AXIAL STRAIN; BEAM PULL-IN VOLTAGE; COMPRESSIVE STRESS; LONG BEAM DEFLECTION; STRESS MEASUREMENT; TRANSVERSE DEFLECTION;

THIN FILMS;

EID: 0029303827     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/0924-4247(95)00987-6     Document Type: Article

References (8)

1. Effect of deposition condition on intrinsic stress in a Si:H films
2. Mechanical property measurement of composite rectangular membrane
3. Measurement of the mechanical properties of silicon microresonators
4. Comparison of techniques for measuring both compressive and tensile stress in thin films
5. Static and dynamic aspects of an air-gap capacitor
6. Fabrication of micromechanical devices from poly-silicon films with smooth surfaces
7. Study of fabrication process of a micro electrostatic switch and its application to a micromechanical V–F converter