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Volumn 103, Issue 1-2, 2003, Pages 42-47

On the single-chip condenser miniature microphone using DRIE and backside etching techniques

Author keywords

Backside etching techniques; DRIE etching techniques; Single chip condenser miniature microphone

Indexed keywords

CAPACITORS; ELECTRIC POTENTIAL; ELECTROSTATICS; ETCHING; FINITE ELEMENT METHOD; RESIDUAL STRESSES; SENSITIVITY ANALYSIS; SINGLE CRYSTALS;

EID: 0037439052     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(02)00326-6     Document Type: Conference Paper
Times cited : (38)

References (11)
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  • 7
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    • Design, simulation and evaluation of novel corrugated diaphragms based on backside sacrificial layer etching technique
    • Nanjing, China, November
    • J. Chen, L. Liu, Z. Li, Design, simulation and evaluation of novel corrugated diaphragms based on backside sacrificial layer etching technique, in: Proceedings of SPIE Optoelectronics and Microelectronics (OM 2001), Nanjing, China, November 2001, pp. 79-83.
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    • J. Chen, L. Liu, Z. Li, Development of a CMOS compatible process for silicon miniature microphone with a high sensitivity, in: Proceedings of International Conference on Sensing Unit and Sensor Technology, SPIE, vol. 4414, Wuhan, China, October 2001, pp. 276-279.
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    • Chen, J.1    Liu, L.2    Li, Z.3
  • 10
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    • Design and fabrication of silicon condenser microphone using corrugated diaphragm technique
    • Q. Zou, Z. Wang, R. Lin, S. Yi, H. Gong, M. Lim, Z. Li, L. Liu, Design and fabrication of silicon condenser microphone using corrugated diaphragm technique, J. Micromech. Microeng. 7 (1997) 310-315.
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.