Copper thin coating deposition on natural pollen particles

Applied Surface Science

Volumn 183, Issue 1-2, 2001, Pages 58-61

  Xu, Lina ^a   Zhou, Kaichang ^a   Xu, Hongfei ^a   Zhang, Haiqian ^a   Huang, Lan ^a   Liao, Jianhui ^a   Xu, Aiqun ^a   Gu, Ning ^a   Shen, Haoying ^b   Liu, Juzheng ^a  

^a SOUTHEAST UNIVERSITY   (China)

^b NANJING ELECTRONIC DEVICES INSTITUTE   (China)

Author keywords

Copper; Core shell structure; Electroless plating technique; Pollen

Indexed keywords

AGGLOMERATION; AUGER ELECTRON SPECTROSCOPY; CATALYST ACTIVITY; COPPER COMPOUNDS; CRYSTAL ATOMIC STRUCTURE; DEPOSITION; ELECTROLESS PLATING; METALLIC MATRIX COMPOSITES; NANOSTRUCTURED MATERIALS; PARTICLE SIZE ANALYSIS; SCANNING ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

CORE-SHELL STRUCTURE;

METALLIC FILMS;

EID: 0035851308     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(01)00563-3     Document Type: Article

References (16)