Electroless copper plating on PET fabrics using hypophosphite as reducing agent

Surface and Coatings Technology

Volumn 201, Issue 16-17, 2007, Pages 7018-7023

  Gan, Xueping ^a   Wu, Yating ^a   Liu, Lei ^a   Shen, Bin ^a   Hu, Wenbin ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Crystal structure; Deposition rate; Electroless copper plating; Hypophosphite; PET fabric; Potassium ferrocyanide; Surface morphology; Surface resistance

Indexed keywords

CRYSTAL STRUCTURE; DEPOSITION RATES; ELECTROLESS PLATING; FABRICS; NICKEL; POLYETHYLENE TEREPHTHALATES; SURFACE MORPHOLOGY; SURFACE RESISTANCE;

ELECTROLESS COPPER PLATING; HYPOPHOSPHITE; SHIELDING EFFECTIVENESS;

COPPER PLATING;

COPPER PLATING; CRYSTAL STRUCTURE; DEPOSITION RATES; ELECTROLESS PLATING; FABRICS; NICKEL; POLYETHYLENE TEREPHTHALATES; SURFACE MORPHOLOGY; SURFACE RESISTANCE;

EID: 34047244749     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2007.01.006     Document Type: Article

References (24)

1. Ott H.W. Noise Reduction Techniques in Electronic Systems. 2nd ed. (1988), John Wiley & Sons
2. Paul C.R. Introduction to Electromagnetic Compatibility (1992), John Wiley & Sons
3. Huang C.-Y., Mo W.-W., and Roan M.-L. Surf. Coat. Technol 184 (2004) 123
4. Zhao F. Mater. Dev. Appl. 16 5 (2001) 29 (Chinese)
5. Wang J. New Chem. Mater. 30 7 (2002) 16 (Chinese)
6. Han E.G., Oh K.W., and Kim E.A. J. Korean Soc. Cloth. Text. 23 5 (1995) 694
7. Han E.G., Kim E.A., and Oh K.W. Synth. Met. 123 (2001) 469
8. Bitian Z., Guoxun L., and Junying Z. Environ. Eng. 13 3 (1995) 38 (Chinese)
9. Wenxing C., Yanqing Y., and Zhicheng Y. J. Zhejiang Sichou Ins. Technol. 15 4 (1998) 265 (Chinese)
10. Li J., and Kohl P.A. J. Electrochem. Soc. 150 8 (2003) 558
11. Cheng D.H., Xu W.Y., Zhang Z.Y., and Yiao Z.H. Met. Finish. 95 1 (1997) 34
12. Li J., and Kohl P.A. J. Electrochem. Soc. 149 12 (2002) 631
13. Li J., Hayden H., and Kohl P.A. Electrochim. Acta 49 (2004) 1789
14. Hung A. Plating Surf. Finish. 75 1 (1988) 62
15. Hung A., and Ohno I. J. Electrochem. Soc. 137 3 (1990) 918
16. Hung A., and Chen K.M. J. Electrochem. Soc. 136 1 (1989) 72
17. Hung A. J. Electrochem. Soc. 132 5 (1985) 1047
18. Hung A. J. Electrochem. Soc. 133 7 (1986) 1350
19. R. Goldstein, P.E. Kukanskis, J.J. Grunwald. U.S. patent 4,265,943 (1981).
20. Simon R.M., and Stutz D. EMC Technol. 2 4 (1983) 39
21. Hewlett-Packard Co. H.P. 8752 operation manual, performance tests (1996) 4-36
22. Paul C.R. Introduction to Electromagnetic Compatibility (1992), Wiley, New York. 0-471-54927-4 650
23. Bernhard K. Principles of Electromagnetic Compatibility (1979), Artech House, Dedham, Mass
24. Fuchen Z. Mater. Dev. Appl. 16 5 (2001) 29 (Chinese)