Strain-rate effects on mechanical properties for SAC387 and SAC105-Y solder

Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC

Volumn , Issue , 2008, Pages 845-850

  Xu, Luhua ^a   Kok, Ee Tan ^a   Pang, John H L ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Continuous stiffness measurement; Drop impact; Nano indentation; Solder joint; Strain rate

Indexed keywords

CONTINUOUS STIFFNESS MEASUREMENT; DROP IMPACT; POWER LAWS; RATE EFFECTS; ROOM TEMPERATURES; SOLDER ALLOYS; SOLDER JOINT; SURFACE FINISHES; TEST RESULTS; TO CURVES; YIELD STRENGTHS;

BRAZING; COPPER; DROPS; ELASTIC MODULI; MECHANICAL PROPERTIES; NANOINDENTATION; SILVER; SILVER ALLOYS; STIFFNESS; STRAIN; STRESSES; TIN; WELDING; YIELD STRESS; YTTRIUM ALLOYS;

STRAIN RATE;

EID: 58149104063     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2008.4684462     Document Type: Conference Paper

References (10)

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