Fabrication of Ag micromaterials by utilizing stress-induced migration

Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC

Volumn , Issue , 2008, Pages 507-510

  Saka, M ^a   Yasuda, M ^a   Tohmyoh, H ^a   Settsu, N ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTIVITY; ELECTRIC WIRE; FABRICATION; NANOWIRES; PASSIVATION; SILICON COMPOUNDS;

AG NANOWIRES; ATOMIC DIFFUSIONS; CHEMICAL TECHNIQUES; DRIVING FORCES; ELECTRONIC INDUSTRIES; HIGH ELECTRICAL CONDUCTIVITIES; HIGH TEMPERATURES; HYDROSTATIC STRESSES; KEY MATERIALS; METALLIC NANOWIRES; OXIDE LAYERS; PASSIVATION LAYERS;

SILVER;

EID: 58149097755     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2008.4684400     Document Type: Conference Paper

References (9)

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