Formation of metallic nanowires by utilizing electromigration

Journal of Materials Research

Volumn 20, Issue 10, 2005, Pages 2712-2718

  Saka, M ^a   Ueda, R ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSIVE STRESS; ELECTROMIGRATION; ETCHING; FIELD EMISSION MICROSCOPES; NANOSTRUCTURED MATERIALS; PASSIVATION; PHOTOLITHOGRAPHY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; REACTIVE ION ETCHING; SCANNING ELECTRON MICROSCOPY;

METALLIC NANOWIRES; WET ETCHING;

ALUMINUM;

EID: 29144504068     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2005.0340     Document Type: Article

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