Inhibitors for organic phosphonic acid system abrasive free polishing of Cu

Applied Surface Science

Volumn 255, Issue 7, 2009, Pages 4114-4118

  Wei, Zhang ^a   Xinchun, Lu ^a   Yuhong, Liu ^a   Guoshun, Pan ^a   Jianbin, Luo ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

Abrasive free; Chemical mechanical polishing; Copper; Inhibitor; Organic phosphonic acid

Indexed keywords

ABRASIVES; CHEMICAL MECHANICAL POLISHING; COPPER; ETHYLENE; POLISHING; SLURRIES; SURFACE REACTIONS; SURFACE ROUGHNESS; THIOUREAS; X RAY PHOTOELECTRON SPECTROSCOPY;

ABRASIVE-FREE POLISHING; ABRASIVE-FREE SLURRIES; COMPOUND INHIBITORS; INHIBITOR; MATERIAL REMOVAL RATE; PHOSPHONIC ACIDS; PRECISION POLISHING; SURFACE CHEMICAL REACTIONS;

ASCORBIC ACID;

EID: 58149090271     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2008.10.096     Document Type: Article

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