Self-conditioning of encapsulated abrasive pad in chemical mechanical polishing

Journal of Materials Processing Technology

Volumn 142, Issue 3, 2003, Pages 614-618

  Kim, Hoyoun ^a   Kim, Hyoungjae ^a   Jeong, Haedo ^a   Seo, Heondeok ^a   Lee, Sangick ^b  

^a Pusan National University   (South Korea)

^b Hynix Semiconductor Inc   (South Korea)

Author keywords

Chemical mechanical polishing; Encapsulated abrasive pad; Environmentally benign process; Hydrophilic polymer; Self conditioning

Indexed keywords

ABRASIVES; HYDROPHILICITY; SEMICONDUCTOR DEVICE MANUFACTURE; SWELLING;

HYDROPHILIC POLYMER;

CHEMICAL MECHANICAL POLISHING;

EID: 0141959061     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-0136(03)00641-1     Document Type: Article

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