Interaction between abrasive particles and films during chemical-mechanical polishing of copper and tantalum

Thin Solid Films

Volumn 497, Issue 1-2, 2006, Pages 321-328

  Li, Ying ^a   Zhao, Junzi ^b   Wu, Ping ^b   Lin, Yong ^b   Babu, S V ^a   Li, Yuzhuo ^b  

^a Clarkson University   (United States)

^b CLARKSON UNIVERSITY   (United States)

Author keywords

Chemical mechanical polishing

Indexed keywords

ABRASIVES; CHEMICAL MECHANICAL POLISHING; COPPER; MICROELECTRONICS; OXIDATION; TANTALUM;

ABRASIVE PARTICLES; INTERCONNECTS; SURFACE QUALITY;

THIN FILMS;

EID: 30344474002     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.09.189     Document Type: Article

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