Interfacial reaction and bump shear property of electroplated Sn-37Pb solder bump with Ni under bump metallization during multiple reflows

Advanced Materials Research

Volumn 15-17, Issue , 2007, Pages 181-186

  Koo, Ja Myeong ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Ball shear test; Electroplating; Flip chip; Intermetallic compound (IMC); Multiple reflows; Ni under bump metallization (Ni UBM); Sn Pb (tin lead) solder

Indexed keywords

BRAZING; BRITTLE FRACTURE; DUCTILE FRACTURE; ELECTROCHEMISTRY; ELECTROPLATING; FRACTURE; INTERMETALLICS; LEAD; LEAD ALLOYS; LEAD COMPOUNDS; METALLIZING; NICKEL; SEMICONDUCTING INTERMETALLICS; SOLDERING; SOLDERING ALLOYS; TITANIUM COMPOUNDS; WELDING;

BALL SHEAR TEST; FLIP CHIP; INTERMETALLIC COMPOUND (IMC); MULTIPLE REFLOWS; NI UNDER BUMP METALLIZATION (NI UBM); SN-PB (TIN-LEAD) SOLDER;

TIN;

EID: 57649100145     PISSN: 10226680     EISSN: None     Source Type: Book Series    
DOI: None     Document Type: Conference Paper

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