An application of 3-D MEMS packaging: Out-of-plane quadrupole mass filters

Journal of Microelectromechanical Systems

Volumn 17, Issue 6, 2008, Pages 1430-1438

  Velásquez García, Luis F ^a   Cheung, Kerry ^a   Akinwande, Akintunde I ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

3 D packaging; Mass filter; Out of plane quadrupole; Second stability region

Indexed keywords

ASPECT RATIO; MEMS; MICROELECTROMECHANICAL DEVICES; WAVE FILTERS;

3-D MEMS; 3-D PACKAGING; HIGHER RESOLUTIONS; MASS FILTER; OUT-OF-PLANE QUADRUPOLE; PEAK SPLITTING; PEAK WIDTHS; QUADRUPOLE MASS FILTERS; QUADRUPOLES; REACTIVE IONS; RF FREQUENCIES; SECOND STABILITY REGION; STABILITY REGIONS;

REACTIVE ION ETCHING;

EID: 57449083766     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2008.2006769     Document Type: Article

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