3-D silicon probe array with hybrid polymer interconnect for chronic cortical recording

International IEEE/EMBS Conference on Neural Engineering, NER

Volumn 2003-January, Issue , 2003, Pages 181-184

  Hetke, J F ^a   Williams, J C ^a,b   Pellinen, D S ^a   Vetter, R J ^a   Kipke, D R ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

^b UNIVERSITY OF WISCONSIN MADISON   (United States)

Author keywords

Animals; Assembly; Humans; Polymers; Probes; Prosthetics; Robustness; Rodents; Semiconductor thin films; Silicon devices

Indexed keywords

ANIMALS; ASSEMBLY; CABLES; MAMMALS; NEURAL PROSTHESES; POLYMERS; PROBES; PROSTHETICS; ROBUSTNESS (CONTROL SYSTEMS); SEMICONDUCTOR DEVICES; SILICON; THIN FILMS;

CORTICAL RECORDING; HUMANS; MECHANICALLY ROBUST; RAT MOTOR CORTEX; RODENTS; SEMICONDUCTOR THIN FILMS; SILICON DEVICES; THERMO-COMPRESSION;

SEMICONDUCTING SILICON;

EID: 84942571168     PISSN: 19483546     EISSN: 19483554     Source Type: Conference Proceeding    
DOI: 10.1109/CNE.2003.1196787     Document Type: Conference Paper

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