Heat-cycle endurance and in-plane thermal expansion of Al2O 3/Al substrates formed by aerosol deposition method

Journal of the Ceramic Society of Japan

Volumn 116, Issue 1360, 2008, Pages 1299-1303

  Sakamaki, Ryo ^a   Hoshina, Takuya ^a   Kakemoto, Hirofumi ^a   Yasuda, Kouichi ^a   Takeda, Hiroaki ^a   Akedo, Jim ^a   Tsurumi, Takaaki ^b  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

^b NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

Aerosol deposition method; Heat radiation; High power module; Thermal expansion coefficient

Indexed keywords

AEROSOLS; ALUMINUM NITRIDE; DEPOSITION; ELECTRIC POWER SYSTEMS; HEAT RADIATION; RESPIRATORY MECHANICS; SUBSTRATES; THERMAL EXPANSION; THICK FILMS;

AEROSOL DEPOSITION METHOD; AL SUBSTRATE; ALN CERAMIC; BRAZED ALUMINUM; ENDURANCE TEST; HIGH POWER MODULE; NANOSIZED GRAINS; THERMAL EXPANSION COEFFICIENTS;

ALUMINUM;

EID: 57149126502     PISSN: 18820743     EISSN: 13486535     Source Type: Journal    
DOI: 10.2109/jcersj2.116.1299     Document Type: Article

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