Enhancement of densification and thermal conductivity in AlN ceramics by addition of nano-sized particles

Journal of the American Ceramic Society

Volumn 89, Issue 1, 2006, Pages 377-380

  Qiu, Jin Yu ^a   Hotta, Yuji ^a   Watari, Koji ^a,c   Mitsuishi, Kenshi ^b  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^b MITSUI CHEMICALS INC   (Japan)

^c AMERICAN CERAMIC SOCIETY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALN CERAMICS; NANO-SIZED PARTICLES; TUNGSTEN RESISTANCE FURNACE;

CERAMIC MATERIALS; DENSIFICATION; NANOSTRUCTURED MATERIALS; SINTERING; THERMAL CONDUCTIVITY; TUNGSTEN;

ALUMINUM NITRIDE;

EID: 33645118461     PISSN: 00027820     EISSN: 15512916     Source Type: Journal    
DOI: 10.1111/j.1551-2916.2005.00692.x     Document Type: Conference Paper

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