Effects of thermal processing on thermal expansion coefficient of a 50 vol.% SiCp/Al composite

Materials Chemistry and Physics

Volumn 72, Issue 1, 2001, Pages 42-47

  Kim, Byung G ^a   Dong, S L ^a,b   Park, Su D ^a  

^a Korea Electrotechnology Research Institute (KERI)   (South Korea)

^b HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Aluminum matrix composite; Electronic packaging; Residual stress; Squeeze casting; Thermal expansion

Indexed keywords

CASTING; FURNACES; QUENCHING; RESIDUAL STRESSES; SILICON CARBIDE; THERMAL EFFECTS; THERMAL EXPANSION; VOLUME FRACTION;

THERMAL EXPANSION COEFFICIENTS (CTE);

COMPOSITE MATERIALS;

EID: 0035419468     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0254-0584(01)00306-6     Document Type: Article

References (20)

1. Selection guidelines for metal matrix composites
2. Thermal expansion measurements of MMCs