Simulation of electroless deposition of Cu thin films for very large scale integration metallization

Journal of the Electrochemical Society

Volumn 144, Issue 6, 1997, Pages 2115-2122

  Smy, T ^a   Tan, L ^a   Dew, S K ^b   Brett, M J ^b   Shacham Diamand, Y ^c   Desilva, M ^c  

^a CARLETON UNIVERSITY   (Canada)

^b UNIVERSITY OF ALBERTA   (Canada)

^c School of Operations Research and Industrial Engineering   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; COMPUTER SIMULATION; COPPER; DIFFUSION IN SOLIDS; ELECTROLESS PLATING; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; METALLIZING; NONLINEAR EQUATIONS; REACTION KINETICS; THIN FILMS; VLSI CIRCUITS;

SOFTWARE PACKAGE SIMBAD;

METALLIC FILMS;

EID: 0031162932     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1837750     Document Type: Article

References (10)

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