A two-dimensional computer simulation of electroless copper deposition

Journal of the Electrochemical Society

Volumn 144, Issue 4, 1997, Pages 1340-1343

  Shigematsu, K ^a   Kondo, K ^a   Hayakawa, K ^a   Irie, M ^b  

^a DENSO CORPORATION   (Japan)

^b KYUSHU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION; COMPLEXATION; COMPUTER SIMULATION; COPPER COMPOUNDS; MONTE CARLO METHODS; ORGANOMETALLICS;

ADSORPTION CONSTANTS; AMINE LIGANDS; COPPER DEPOSITION;

ELECTROLESS PLATING;

EID: 0031123553     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1837594     Document Type: Article

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