Multi-domain simulation of transient junction temperatures and resulting stress-strain behavior of power switches for long-term mission profiles

11th IEEE Workshop on Control and Modeling for Power Electronics, COMPEL 2008

Volumn , Issue , 2008, Pages

  Drofenik, Uwe ^a   Kovacevic, Ivana ^a   Schmidt, Roland ^b   Kolar, Johann W ^a  

^a ETH ZURICH   (Switzerland)

^b ABB SWITZERLAND LTD   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; CIRCUIT SIMULATION; SILICON; TECHNICAL PRESENTATIONS; WELDING;

COMPUTATIONAL EFFORTS; JUNCTION TEMPERATURES; LIFETIME ESTIMATIONS; MISSION PROFILES; MULTI DOMAINS; POWER MODULES; POWER SWITCHES; SIMULATION SOFTWARES; STRESS STRAINS; SWITCHING LOSSES; THERMAL SIMULATIONS; TRACTION APPLICATIONS; TRANSIENT SIMULATIONS;

POWER ELECTRONICS;

EID: 56649086928     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/COMPEL.2008.4634691     Document Type: Conference Paper

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