Development and validation of lead-free wave soldering process

Soldering and Surface Mount Technology

Volumn 12, Issue 3, 2000, Pages 29-34

  Forstén, Atso ^a   Steen, Hector ^b   Wilding, Ian ^b   Friedrich, Jürgen ^c  

^a Teleste Access Systems   (Finland)

^b Multicore Solders Ltd   (United Kingdom)

^c Ersa Löttechnik   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EUTECTICS; FLUXES; PRINTED CIRCUIT BOARDS; SOLDERING; TIN ALLOYS;

LEAD FREE WAVE SOLDERING;

SURFACE MOUNT TECHNOLOGY;

EID: 0033645152     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910010347872     Document Type: Article

References (9)

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2. de Kluizenaar, E.E. (1983), "Surface oxidation of molten soft solder: an auger study", J.Vac.Sci.Technol. A. Vol. 1 No. 3, July-September, pp. 1480-5.
3. Gickler, A., Loomans, M. and Willi, C. (1997), "Contamination of lead-free solders with copper and lead", Surface Mount Technology, pp. 44-8.
4. Jacobson, D.M. and Harrison, M. (1997), "Lead-free soldering: a progress report", GEC Journal of Research, Vol. 14 No. 2, pp. 98-109.
5. Kurz, R. and Kleiner, E. (1971), "Uber das Anlaufverhalten von flussigen Zinn-Blei-Loten", Z.f. Werkstofftechnik, Vol. 2, pp. 418-22.
6. Laine-Ylijoki, T., Steen, H.A.H. and Forstén, A. (1997), "Development and validation of a lead-free alloy for solder paste applications", Future Circuits, Issue 1 Vol. 2, pp. 183-5.
7. Stoneman, A.M., Mackay, C.A. and Thwaites, C.J. (1980), "Oxidation and drossing of molten solders: effects of impurities", Metals Technology, Vol. 7, pp. 226-31.
8. Vincent, J.H. and Humpston, G. (1994), "Lead-free solders for electronic assembly", GEC Journal of Research, Vol. 11 No. 2, pp. 76-89.
9. Warwick, M. (1999), "Implementing lead-free soldering", Proceedings of SMTA International Conference, San Jose, September, pp. 378-98.