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Volumn 5273, Issue , 2004, Pages 244-249

Enhancement of surface-damage resistance by removing a subsurface damage in fused silica

Author keywords

CeO2; Chemical etching; Fused silica; Ion beam etching; Subsurface damage; Surface damage resistance

Indexed keywords

CERIUM COMPOUNDS; ELECTROMAGNETIC FIELDS; ETCHING; FRACTURE; ION BEAMS; LASER DAMAGE; POLISHING; SURFACE PROPERTIES;

EID: 5544251278     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.524961     Document Type: Conference Paper
Times cited : (44)

References (7)
  • 1
    • 0031289899 scopus 로고    scopus 로고
    • Subsurface damage and polishing compound affect the 355-nm laser damage threshold of fused silica surfaces
    • D. W. Camp, M. R. Kozolowski, L. M. Sheehan, M. Nichols, M. Dovik, R. Raether, I. Thomas, "Subsurface damage and polishing compound affect the 355-nm laser damage threshold of fused silica surfaces," SPIE Proceedings, Volume 3244, pages 356-364, 1997.
    • (1997) SPIE Proceedings , vol.3244 , pp. 356-364
    • Camp, D.W.1    Kozolowski, M.R.2    Sheehan, L.M.3    Nichols, M.4    Dovik, M.5    Raether, R.6    Thomas, I.7
  • 4
    • 0029223230 scopus 로고
    • Glass surface atomic structure after technological treatments
    • E. O. Filatova and A. S. Shulakov, "Glass surface atomic structure after technological treatments," SPIE Proceedings, Volume 2453, pp. 122-129, 1995.
    • (1995) SPIE Proceedings , vol.2453 , pp. 122-129
    • Filatova, E.O.1    Shulakov, A.S.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.