Subsurface damage and polishing compound affect the 355-nm laser damage threshold of fused silica surfaces

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3244, Issue , 1997, Pages 356-364

  Camp, D W ^a   Kozlowski, M R ^a   Sheehan, L M ^a   Nichols, M ^a   Dovik, M ^a   Raether, R ^a   Thomas, I ^a  

^a LAWRENCE LIVERMORE NATIONAL LABORATORY   (United States)

Author keywords

3 omega; Ceria; Fused silica; Grinding; Laser damage; Optics; Polishing; Subsurface damage; Ultraviolet; Zirconia

Indexed keywords

ETCHING; FRACTURE; GRINDING (MACHINING); LASER DAMAGE; MAGNETOELECTRIC EFFECTS; MICROSCOPIC EXAMINATION; POLISHING; SURFACE ROUGHNESS; ZIRCONIA;

SCRATCHING;

FUSED SILICA;

EID: 0031289899     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.307044     Document Type: Conference Paper

References (15)

1. The effect of subsurface defects on "incipient" (below threshold) laser damage nucleation in fused silica optical flats
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6. Temperature rise of an absorbing ceria particle
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8. Depth profiling of polishing-induced contamination on fused silica surfaces
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10. Effect of etching and imaging mode on the measurement of subsurface damage in microground optical glasses
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12. Application of total internal reflection microscopy for laser damage studies on fused silica
13. Laser-induced damage of fused silica at 355 nm initiated at scratches
14. A statistical study of UV laser-induced failure of fused silica
15. A study of the effects of polishing, etching, cleaving, and water leaching on the UV laser damage of fused silica