Depth profiling of polishing-induced contamination on fused silica surfaces

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3244, Issue , 1997, Pages 365-375

  Kozlowski, M R ^a   Carr, J ^a   Hutcheon, I ^a   Torres, R ^a   Sheehan, L ^a   Camp, D ^a   Yan, M ^a  

^a LAWRENCE LIVERMORE NATIONAL LABORATORY   (United States)

Author keywords

355 nm; CeO2; Contaminants; Fused silica; Polishing; Surface

Indexed keywords

CHEMICAL MECHANICAL POLISHING; COMPUTATIONAL METHODS; IMPURITIES; LASER DAMAGE; SPECTROSCOPIC ANALYSIS; THERMOMECHANICAL TREATMENT; ULTRAVIOLET RADIATION;

OPTICAL SURFACES; ULTRAVIOLET OPTICS;

FUSED SILICA;

EID: 0031289588     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.307031     Document Type: Conference Paper

References (11)

1. Chemical processes in glass polishing
2. The detection, removal, and effect on damage threshold of cerium impurities on fused silica
3. A study of the effects of polishing, etching, cleaving, and water leaching on the UV laser damage of fused silica
4. The effect of sub-surface damage on fused silica laser damage
5. Laser-induced damage of fused silica at 355 nm initiated at scratches
6. Laser-induced damage of fused silica surfaces at 355 and 1064 nm initiated at aluminum contamination particles on the surface
7. A spectroscopic ellipsometry study of cerium dioxide thin films grown on sapphire by rf magnetron sputtering