Electrical properties of Cu nanowires

2008 8th IEEE Conference on Nanotechnology, IEEE-NANO

Volumn , Issue , 2008, Pages 549-552

  Huang, Qiaojian ^a   Lilley, Carmen M ^a   Bode, Matthias ^b   Divan, Ralu S ^b  

^a University of Illinois at Chicago   (United States)

^b ARGONNE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC PROPERTIES; ELECTRIC WIRE; ELECTRON BEAM LITHOGRAPHY; NANOSTRUCTURED MATERIALS; NANOSTRUCTURES; NANOTECHNOLOGY; NANOWIRES;

COPPER NANOWIRES; CU FILMS; CU NANOWIRES; ELECTRICAL PROPERTIES; SIZE DEPENDENTS; SIZE EFFECTS; TEMPERATURE COEFFICIENT OF RESISTANCES; THEORETICAL MODELS; WIRE WIDTHS;

COPPER;

EID: 55349113614     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/NANO.2008.163     Document Type: Conference Paper

References (21)

1. A. Husain, J. Hone, H. W. C. Postma, X. M. H. Huang, T. Drake, M. Barbic, A. Seherer, and M. L. Roukes, "Nanowire-based very-high-frequency electromechanical resonator," Applied Physics Letters, vol. 83, pp. 1240-1242, 2003.
2. K. Kim, S. J. Yoon, and D. Kim, "Nanowire-based enhancement of localized surface plasmon resonance for highly sensitive detection: a theoretical study," Optics Express, vol. 14, pp. 12419-12431, 2006.
3. E. C. Walter, R. M. Penner, H. Liu, K. H. Ng, M. P. Zach, and F. Favier, "Sensors from electrodeposited metal nanowires," Surface And Interface Analysis, vol. 34, pp. 409-412, 2002.
4. A. Bid, A. Bora, and A. K. Raychaudhuri, "Temperature dependence of the resistance of metallic nanowires of diameter >= 15 nm: Applicability of Bloch-Gruneisen theorem," Physical Review B, vol. 74, pp. 035426, 2006.
5. S. Maitrejean, R. Gers, T. Mourier, A. Toffoli, and G. Passemard, "Experimental measurements of electron scattering parameters in Cu narrow lines," Microelectronic Engineering, vol. 83, pp. 2396-2401, 2006.
6. W. Steinhogl, G. Schindler, G. Steinlesberger, and M. Engelhardt, "Size-dependent resistivity of metallic wires in the mesoscopic range," Physical Review B, vol. 66, 2002.
7. G. Schindler, G. Steinlesberger, M. Engelhardt, and W. Steinhogl, "Electrical characterization of copper interconnects with end-of-roadmap feature sizes," Solid-State Electronics, vol. 47, pp. 1233-1236, 2003.
8. W. Steinhoegl, G. Schindler, G. Steinlesberger, M. Traving, and M. Engelhardt, "Scaling laws for the resistivity increase of sub-100 nm interconnects," Simulation of Semiconductor Processes and Devices, 2003. SISPAD 2003. International Conference on, pp. 27-30, 2003.
9. K. Fuchs, "The conductivity of thin metallic films according to the electron theory of metals," Proc. Cambridge Philosophical Society, vol. 34, pp. 100-108, 1938.
10. A. F. Mayadas and M. Shatzkes, "Electrical-Resistivity Model for Polycrystalline Films: the Case of Arbitrary Reflection at External Surfaces," Physical Review B, vol. 1, pp. 1382, 1970.
11. P. Rai-Choudhury, Handbook of Microlithography, Micromachining, and Microfabrication, Vol. 1: Microlithography. Bellingham, WA: SPIE, 1997.
12. E. H. Sondheimer, "The mean free path of electrons in metals," Advances in Physics, vol. 1, pp. 1 - 42, 1952.
13. D. R. Lide, Handbook of chemistry and physics. New York: CRC, 2005-2006.
14. E. J. Menke, M. A. Thompson, C. Xiang, L. C. Yang, and R. M. Penner, "Lithographically patterned nanowire electrodeposition," Nature Materials, vol. 5, pp. 914-919, 2006.
15. A. Kwatera and A. Sawka, "Preparation of amorphous composites of silicon nitride and carbon layers on silica glass by chemical vapor deposition method," Journal Of Non-Crystalline Solids, vol. 265, pp. 120-124, 2000.
16. B. Stahlmecke and G. Dumpich, "Influence of the electron beam on electromigration measurements within a scanning electron microscope," Applied Physics Letters, vol. 90, pp. 043517, 2007.
17. F. Warkusz, "The size effect and the temperature coefficient of resistance in thin films," Journal of Physics D: Applied Physics, vol. 11, pp. 689-694, 1978.
18. B. S. Verma and S. K. Sharma, "Effect of thermal strains on the temperature coefficient of resistance," Thin Solid Films, vol. 5, pp. R44, 1970.
19. R. W. Berry, P. M. Hall, and M. T. Harris, Thin Film Technology. Princeton, New Jersey: D. Van Nostrand Company, Inc., 1968.
20. P. M. Hall, "The effect of expansion mismatch on temperature coefficient of resistance of thin films," Applied Physics Letters, vol. 12, pp. 212, 1968.
21. J. B. Thompson, "Absolute thermoelectric power and temperature coefficient of resistance of thin continuous metal films," Thin Solid Films, vol. 18, pp. 77, 1973.