SCOPUS 정보 검색 플랫폼

Polymer - Plastics Technology and Engineering

Volumn 41, Issue 3, 2002, Pages 383-405

Simulation of resin flow during compression of copper-clad thermoset composite laminates

(4) Derose, A N a Yuan, M a Osswald, T A a Castro, J M b

a University of Wisconsin Madison (United States)

b Ohio State University (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHANNEL FLOW; COMPACTION; COMPOSITE MATERIALS; COMPUTER SIMULATION; COPPER; MATHEMATICAL MODELS; PLASTIC FLOW; PLASTIC LAMINATES; SEEPAGE; THERMOSETS; VISCOSITY;

FLUID CHANNELS; SQUEEZING FLOW;

EPOXY RESINS;

COPPER; CURING; DIMENSIONAL ANALYSIS; EPOXY RESIN; FLOW MODELING; LAMINATED MATERIAL; VISCOSITY;

EID: 0036612163 PISSN: 03602559 EISSN: None Source Type: Journal
DOI: 10.1081/PPT-120004358 Document Type: Article

Times cited : (3)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.