Estimation of the transient heat transfer rate at the boundary of an electronic chip packaging

Numerical Heat Transfer; Part A: Applications

Volumn 54, Issue 10, 2008, Pages 945-961

  Chen, Wen Lih ^a   Yang, Yu Ching ^a  

^a KUN SHAN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT EXCHANGERS; HEAT TRANSFER; HEATING EQUIPMENT; SPECIFIC HEAT; TEMPERATURE MEASUREMENT; THERMOANALYSIS;

DIRECT PROBLEMS; DISCREPANCY PRINCIPLES; ELECTRONIC CHIPS; HEAT TRANSFER RATES; INVERSE ALGORITHMS; TEMPERATURE DATUM; TEST CASES; TRANSIENT HEAT TRANSFERS;

CONJUGATE GRADIENT METHOD;

EID: 54949102816     PISSN: 10407782     EISSN: 15210634     Source Type: Journal    
DOI: 10.1080/10407780802473574     Document Type: Article

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