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Volumn 205, Issue 4, 2008, Pages 922-926

Spectroscopic ellipsometry study of thin diffusion barriers of TaN and Ta for Cu interconnects in integrated circuits

Author keywords

[No Author keywords available]

Indexed keywords

BARRIER THINS; BILAYER FILMS; COPPER DIFFUSIONS; CU INTERCONNECTS; DEPOSITION CONDITIONS; DIELECTRIC FUNCTIONS; EFFECTIVE MEDIUM APPROXIMATIONS; ELECTRICAL RESISTIVITIES; ELECTRON MEAN FREE PATHS; ELLIPSOMETRIC MEASUREMENTS; ENERGY RANGES; FILM COMPOSITIONS; FREE CARRIERS; LORENTZ MODELS; NATIVE OXIDE LAYERS; OPTICAL AND ELECTRICAL PROPERTIES; REACTIVE MAGNETRON SPUTTERING; SI (100) SUBSTRATES; SINGLE LAYERS; TANTALUM NITRIDES; UV-VISIBLE;

EID: 54849403578     PISSN: 18626300     EISSN: 18626319     Source Type: Journal    
DOI: 10.1002/pssa.200777831     Document Type: Article
Times cited : (9)

References (15)
  • 6
    • 0002387823 scopus 로고    scopus 로고
    • San Francisco, June
    • D. Edelstein et al., Proc. IITC, San Francisco, June 2001, p. 9.
    • (2001) Proc. IITC , pp. 9
    • Edelstein, D.1
  • 14
    • 16844386967 scopus 로고    scopus 로고
    • Stampfl and A.J. Freeman, Phys. Rev. B 71, 024111 (2005).
    • Stampfl and A.J. Freeman, Phys. Rev. B 71, 024111 (2005).


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.